Example 1:

The customer contacted us with a plan for a 3-Layer MCPCB design. After reviewing their requirements and the sensitivity of their application, we advised an additional layer to act as a ground plain to reduce EMI.

The final design utilizes a Copper Base for improved thermal conductivity and enabling to ground of all the capacitors. The design includes both thermal and electrical vias filled with Dupont's CB100 for improved conductivity.

     
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Example 2:

The customer contacted us with a plan for a multi-part assembly consisting of the Metal Core PCB, which would then be affixed to a heat-sink assembly.

We developed a new lamination process that allowes us to mount the PCB directly to the heat-sink with T-Lam PP material. The end result is a stand-alone PCB/Heat-sink assembly that costs less, minimizing manufacturing processes while improving thermal management characteristics.

     
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The customer's MCPCBs were experiencing thermal issues while getting no Application Engineering team support from another fabricator. The client assumed their maximum height restrictions limited their options and were close to scrapping the entire project.

By taking some time to better understand their application, we were able to take advantage of increased thickness of the base-plate from .062" to .0125" by utilizing counter-bored mounting screw holes. We also were able to make use of an improved thermal laminate to increase thermal dissipation and resolve their issues beyond expectations.

       
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