Laird (Tlam ML 1KA)

The printed circuit boards (PCB) material technology is the thermally-conductive pre-preg (PP) that allows single-sided (SS) and multi-layer circuits to be made. The PP is formed into sheets in several thicknesses and is used to bond the integrated heat spreader to the circuit copper for the SS construction and two circuit copper sheets (DS) as a base for the ML constructions. There are three major applications for thermally-conductive PCB materials: power converters, motor controls, and LED lighting.  Tlam™ thermally-conductive PCB substrates provide 8-10 times the heat dissipation compared to conventional FR4-based PCBs. The miniaturation of electronic devices continues to pack more and more power into smaller and smaller packages. The simplicity of the Tlam™ system takes the heat dissipation requirement in stride without significant design changes. The Tlam™ dielectrics are the key to these high-performance PCB substrates. The Tlam™ dielectric provides electrical isolation, thermal transfer, and adhesion layer for the substrates that are created for your specific needs. The Tlam™ system is available in a wide variety of constructions. Tlam™ SS is the single side PCB substrate. Tlam™ DS is a double-sided copper laminates and Tlam™ PP is the dielectrics used to bond multi-layer PCB together. The Tlam™ system is the most versatile thermally-enhanced PCB substrate on the Market.

                                      Multi-layer Constructions Based on TlamDS1KA